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We
currently offer one of the largest collections of interactive CD-ROM
in the industry dedicated to printed board design and assembly which
are ideal to support your on site training requirements. If you
need to produce your own training courses, inspection documents
or illustrate technical reports we also offer many photo albums
packaged with images to make the creation of presentation material
less time consuming for engineers and administrators. LGA/QFN Design, Assembly, Rework & Defect Guide If you are using PowerPoint for training or technical sales presentations and need to illustrate the conventional, surface mount & LGA/QFN assembly process stages this CD-ROM is for you. The CD features three presentations: LGA/QFN
Design and Assembly Process
Printed board design and layout is the key to Zero Defect Manufacture and particularly true for lead-free. Design and development engineers must convert their build of materials to make all components lead-free and process compatible. This CD-ROM provides a basic introduction to Conventional, Surface Mount, Ball Grid Array and Pin In Hole/Intrusive Reflow Assembly including changes for lead-free with the following: Conventional
and surface mount layout |
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Soldertec
Lead-Free Wave Soldering Interactive CD-ROM
Third
in a series of interactive CD-ROMs developed by Soldertec Global
to assist engineers with the practical introduction of lead-free
wave soldering materials and processes. Introduced by Kay Nimmo,
Technical Director, Tin Technology, the CD provides a step-by-step
guide to wave soldering, wetting, fluxing, process control, inspection.
Process animations explain the wave soldering process options and
video is used to further enhance the process stages. Inspection
criteria for wave solder joints are illustrated for different alloys.
Common wave soldering defects are included which may be seen in
manufacture, reasons and possible corrective action is provided.
The CD also features an interactive quiz on wave, reflow and hand
soldering to help assess staff’s knowledge on the use of lead-free
materials. |
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Lead-Free Reflow Soldering Interactive CD-ROMInteractive
CD-ROMs developed by Soldertec Global to assist engineers with the
practical introduction of lead-free materials and processes. Introduced
by Kay Nimmo, Technical Director, Tin Technology, the CD provides
a step-by-step guide to solder paste materials, convection and vapour
phase soldering steps, lead-free inspection and common reflow defects
which may be seen in manufacture. The process stages and defects
are illustrated with video clips. The CD also features an interactive
quiz on hand, reflow and wave soldering to help assess staff’s
knowledge on the use of lead-free materials. Additional CD-ROMs
will be released shortly covering other aspects of lead-free alloys
and the changes necessary in manufacture to meet the deadline of
July 2006. |
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Conformal Coating Inspection & Defect Photo Album CD-ROM A photo CD-ROM provides process, quality engineers, marketing or editorial staff with a unique source of photographs which may be used in company inspection documents, technical presentations and web sites. The photographs can also be used in marketing and advertising material or in technical articles. They may be simply pasted into any Word or PowerPoint document for in house company use. The following are some of the images included on this CD: Coating Runs, Fish Eye Bubbles, Bug Eye Bubbles, Corrosion Under Coating, Non/De-Wetting, Coating Penetration on Pins, Solder Balls, Coating Contamination, Brush Fibres, Sulphur Corrosion, Coat Cracking, Coating Shadowing, Excessive Coating Contamination, Conformal Coating Separation, Bubble and Coating Lift, Copper Dendrite Formation, Chipped UV Coating, Fingerprint After Coating, Finger Print Before Coating plus many more |
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Conventional Component Assembly & Soldering Photo CD-ROM A photo CD-ROM provides process, quality engineers, marketing or editorial staff with a unique source of photographs which may be used in company inspection documents, technical presentations and web sites. The photographs can also be used in marketing and advertising material or in technical articles. They may be simply pasted into any Word or PowerPoint document for in house company use. The following are some of the images included on this CD: Tin/lead contamination, Resist failure, Resist crinkle, PCB delaminating, Uneven solder levelling, Uneven tin/lead, Plating failure, Legend contamination, Resist contamination, Chip Leaching, Poor solderability, Plastic cracking, Capacitor cracking, Poor solderability, SOT23 Plastic softening, QFP cracking, Poor coplanarity, Solder beading, Poor solderability, Crystallised joints, Cracked joint, Poor pad wetting, Component lift, No wetting, Joint voiding, Solder beading, Solder wicking, PCB measelling, Open joints, Non reflow, Poor penetration, Solder balling, Solder skip, Bulbous joints, Solder webbing plus many more |
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A
photo CD-ROM provides process, quality engineers, marketing or editorial
staff with a unique source of photographs which may be used in company
inspection documents, technical presentations and web sites. The
photographs can also be used in marketing and advertising material
or in technical articles. They may be simply pasted into any Word
or PowerPoint document for in house company use. |
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Flip Chip Assembly & Soldering Photo CD-ROM A photo CD-ROM provides process, quality engineers, marketing or editorial staff with a unique source of photographs which may be used in company inspection documents, technical presentations and web sites. The photographs can also be used in marketing and advertising material or in technical articles. They may be simply pasted into any Word or PowerPoint document for in house company use. The following are some of the images included on this CD: Die mounted on tape in feeder, Close up of sawn wafer on sticky tape back view, Close up of sawn die, Flip chip tape feeder, Fluxing plate, Die on pickup tool, Underfilled die on ceramic board, Flip chip on ceramic board, Die in tape and reel pocket, Die prior to placement, Die being fluxed, Die on sticky tape, Die in waffle tray, Minimal edge damage to die, Edge damage to die, Bump site on die, Resist on bond pads, COB Music Board, Wire Bond Testing, CSP on a phone board, CSP on a phone board, Trial Paste Deposits for flip chip boards, Underfill on glass die, Die and underfill, Flip Chip Print Stencil Apertures, No Flow Underfill after CSP Reflow, Glass die with minimum underfill, CSP with underfill, CSP with excessive underfill, Flip chip after reflow x ray view, Flip chip after reflow x ray view, Laminate x-ray of Joints and Shorts plus lots more |
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Printed Circuit Board Manufacture Defects Photo CD-ROM A photo CD-ROM provides process, quality engineers, marketing or editorial staff with a unique source of photographs which may be used in company inspection documents, technical presentations and web sites. The photographs can also be used in marketing and advertising material or in technical articles. They may be simply pasted into any Word or PowerPoint document for in house company use. The following are some of the images included on this CD: Microsection of plated through hole, Microsection of inner layer, Microsection with laminate voids, Microsection of pad with tin/lead, Microsection plated through hole, Horizontal microsection of resin smear, Cracking on corner of PTH, Resin contamination in copper plating, Poor solderability of through hole, Section showing voiding in multi layer, Section showing tented via hole, Marking ink contamination on resist, Solder mask lift and contamination under mask, Poor solder resist application, Cracking of solder resist coating, Cracked copper plating, Good electroless copper back light test, Exposed tracking due to poor design rules, Damage to resist coating, Surface damage to resist coating, Poor solder levelling, Nicks in tracking, Etching defects on around copper pads, Plating residues in via holes plus many more |
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Solder Paste Printing & Inspection Photo CD-ROM A photo CD-ROM provides process, quality engineers, marketing or editorial staff with a unique source of photographs which may be used in company inspection documents, technical presentations and web sites. The photographs can also be used in marketing and advertising material or in technical articles. They may be simply pasted into any Word or PowerPoint document for in house company use. The following are some of the images included on this CD: Solder paste slumping after print, Solder paste in via holes after cleaning, Misalignment of paste print, Solder paste print smudge, Poor paste clean off, Smudged solder paste print, Misaligned solder paste print, SOT23 solder paste print, Paste deposit on PCB shield, Paste deposit x-ray, Poor solder paste wash off, Satisfactory wash off of PCB, Poor cleaning of stencil, SEM of Poor quality paste particle formation, Component placement on paste deposit, Damage to stencil foil, Damage to stencil aperture bars, Dog ear prints, Print and placement on silver PCB finish, 100% paste deposit on pad surface, Missing paste deposit, Paste deposit and gull chip terminations, Capacitor on paste deposit, 0201 on paste deposit, 01005 average paste print, PIHR paste printing on through hole plus many more images |
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Surface Mount Assembly & Soldering Photo CD-ROM A photo CD-ROM provides process, quality engineers, marketing or editorial staff with a unique source of photographs which may be used in company inspection documents, technical presentations and web sites. The photographs can also be used in marketing and advertising material or in technical articles. They may be simply pasted into any Word or PowerPoint document for in house company use. The following are some of the images included on this CD: Gull wing tip microsection, Solder paste dispensing, misplaced, Adhesive contact area after push testing, Solder flood on the top side of a board assembly, Shielding paste deposits on surface mount boards, Satisfactory solder joint bare toe, Solder paste scooping, 0402 misalignment lead free, PCB Delamination, Chip capacitor cracking, X-ray cracking in LCCC joints, Microsection showing cracking of LCCC joints, 1206 chip resistor lifting, Solder paste slump test on ceramic slide, Bulbous joint of chip resistor, MSD devices in sealed packaging, MSD devices, packaging, Cracks in LCCC Joints, Lead separation from solder surface, lead plating failure, Conductive adhesive joint on chip, Satisfactory joint with solder bead, Mechanical damage to termination plus lots more |
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SMT & Conventional Illustrations CD-ROM A CD-ROM provides process, quality engineers, marketing or editorial staff with a unique source of illustrations which may be used in company inspection documents, technical presentations and web sites. The illustrations can also be used in marketing and advertising material or in technical articles. They may be simply pasted into any Word or PowerPoint document for in house company use. The following are some of the images included on this CD: Illustrations include all surface mount terminations, placement and soldering standards, through hole terminations, solder joints, wire terminations, PCB sections, adhesive and solder paste deposits plus lots more |
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BGA Inspection & Lead-Free Defect Guide Interactive CD-ROM covering optical and x-ray inspection of solder joints produced jointly by Metcal and Bob Willis. It includes an introduction to the lead-free assembly process with specific attention to BGA and area array devices. It provided a step by step guide to the procedure of inspection for optical and x-ray showing you how to do it. Inspection criteria are included for x-ray and visual criteria on different lead-free terminations and pad surfaces. The CD also includes many defect examples and causes as well as illustrating the reflow of different terminations with Bob Willis’s unique micro video clips. |
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2
Fourth Avenue, Chelmsford, Essex, CM1 4HA, England |
Tel:
00(44) 1245 351502 Fax: 00 (44) 1245 496123 Email: bob@ASKbobwillis.com |