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Dendrite failure on printed circuit board assemblies is quite common but often not investigated fully to pin point the root cause. This is due to the intermittent nature of the failure or just replacing components seems to solve the problem. Dendrites are a metallic growth between conductive surfaces which form an intermittent connection causing difficulty in product operation or dramatic failure
Increased dendrite formation is due to:
Decreasing component pitch
Increasing use of poorly implemented coatings
Voltage difference between conductors
Poor consideration of operating environments
Lack of material and product testing
PCB and component cleanliness
Elevated operating temperatures
Increased condensation levels
Dendrites can be copper, silver or other metals forming a fern like structure across insulated surfaces. Depending on situation and the level of moisture a conductive path can form over components, around solder mask and under conformal coatings
What is a dendrite?
Where do they form?
What causes dendrite formation?
Common causes and locations of failure
Does cleaning or conformal coating help?
Can you test materials and product reliability?
Presented by Bob Willis
The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar
All webinar times shown are UK time – to check your local time in your countries click here