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Solder Skip
Any surface mount solder joint not wetted with solder is generally referred to as a solder skip, some people refer to these as insufficient solder joints which is misleading. During assessment of the problem it is important to check if a fresh coating of solder is on the pad or on the component termination. Often the presence or lack of a new solder coating on the leads can indicate the root cause of the problem. The most common causes of skipping are incorrect chip wave height, gassing of flux under the board surface or excess resist thickness. Each of these faults can be easily fixed although the resist may take a little longer if you have a large stock of boards but review your PCB specification. In the example shown adhesive has contaminated the pad surface. Although no adhesive deposit is visible some adhesives allow an invisible film to bleed out from the dot area during curing. Try evaluating your adhesive again there are some simple tests available which can be used for testing glues call EPS for a testing service.