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Solder Ball
Solder balling can be caused by poor process conditions with gassing from the flux during wave contact or excessive turbulence as the solder flows back into the bath which causes spitting. Solder balls can be ejected from the joint area during soldering due to excessive outgassing of the PCB. In the example shown a solder ball is attached to the base of the board on the edge of the resist and must have attached itself to the resist as it separated from the pin.