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Lifted Component
Lifted components can occur during wave soldering for a number of reasons. In the case of the example the part was not inserted correctly prior to entering the soldering process. It is uncommon for IC packages of this size to lift during wave contact. Generally components lift due to: Incorrect lead length causing the leads to hit the solder bath and lift during entry to the wave. Flexure of the board which is commonly seen on large connectors, IC sockets or large IC packages. Basically the board flexes and the component remains still. Light components are lifted by the turbulent wave used for surface mount applications. Components with either different thermal demands or different lead materials. If a lead is slow to wet due to the thermal demand of the component it can lift in the plated through hole and not sit back on to the surface of the board.