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Cracked Solder Joint
The example solder joint shows a crack around the base of the fillet and has separated from the copper pad. This is most likely to be related to the basic solderability of the board. Wetting between the solder and the pad surface has not occurred leading to joint failure. Cracking of joints would normally occur due to the thermal expansion of a joint and this would relate to the original design of the product. It is not very common for failures to occur today due to the experience and pre testing conducted by many leading electronics companies.