07

Poor Lead Solderability
The solder has failed to wet the lead termination but has wetted the through hole. In this case the plating was found to be an issue as the brass pins had not been correctly plated with copper before tin lead plating. The copper plating is necessary to stop zinc migration affecting the tin/lead surface. A minimum of 0.002um is necessary for long solderable life with a minimum of 0.005um of tin/lead over the copper. The components are clearly at fault and this is not a problem associated with the soldering process.