05

Poor Solder Penetration
The solder has failed to fill the plated through hole on one side of the component. The solder has wetted the PCB but failed to fully wet the component lead, which is more likely to be flux related. If the fault is with the process conditions there should be other positions on the board which have a similar problem. Simple solderability testing of the board and component termination should indicate if the fault is process or material related.