In any process there are always opportunities to
improve the process, reduce the number of process stages or reduce the cost of
manufacture. Engineering is always looking at alternative processes, Simultaneous Double
Sided Reflow (SDSR) is a possible new candidate to provide cost savings and increased
throughput. The process will be featured at Nepcon Electronic exhibition next week and is
the latest Interactive CD-ROM available from the SMART Group. The process was first
described in the SMART Group Charity Report SDSRS which has raised money for worthy
projects in the UK and America.
In simple terms the process involves screen printing
and placing components on both sides of the board with the option of using through hole
components. Finally the whole assembly is run through a single reflow soldering process to
solder both sides of the board and potentially the through components as well. It is
currently being considered by two Japanese companies and reported being used by Philips in
Europe and a couple of UK companies.
The interactive CD-ROM covers:
SDSRS Advantages
SDSRS Disadvantages
Screen Printing
Adhesive Dispense
Adhesive Requirements
Component Placement
Reflow Soldering
Final Inspection
Process Issues
Process Results |