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Summary

This CD ROM provides a guide to common process defects found at each stage of the SMT process. It also includes defects specifically on printed boards and components. At the first screen you select the process you want to view which gives you an introduction to the processes listed below.

Printed Boards, Components inc; BGA, Screen Print, Adhesive Application, Placement, Reflow Solder, Wave Solder, Cleaning, Rework

In the case of printed board section it explains the most important issues with surface mount circuits. It then lists common process defects which can be selected to reveal a photographic example of the defect type and an explanation of the possible causes.

Demo

Note: In addition to the Help menu, a text file is also included on the CD-ROM which contains further information on problem solving and system setup for the video clips.

click here to download a Demo Version (procdef.zip file 1.4mb)

1. The program can either be run from the CD or an icon and help menu may be loaded to the hard disk:

1.1 To run from the CD place the CD-ROM in ROM drive and double click on File Manager under Program Manager on the Windows main menu and select relevant drive for the ROM on the PC. Double click on EPS.EXE and the program will start to load. This will take a few moments depending on the speed of the PC.

1.2 To load an icon for the program and help menu to the hard disk, double click on File Manager under Program Manager on the Windows main menu and select relevant drive for the ROM on the PC. Double click on SETUP.EXE to start installation and follow onscreen instructions. On completion of installation double click on the EPS icon in the Process Defects window:

2. The following main menu will then appear:

3. From the main menu select any of the process stages by clicking on the relevant button or title. After making your choice an information screen will appear giving details of the set-up procedure or material requirements of the selected process.

As an example, by clicking on Reflow Solder this screen will be revealed, giving the procedure for setting up a machine for a new product. By clicking on any sub-title in the Process window the relevant section text can be reviewed.

4. Under the Defects window select each of the defect titles in turn and photographs of various process problems will be revealed. Under each of the photographs is a scrolling text window giving detailed information of the possible causes of the illustrated defect.

This defect screen is for Wave Soldering and operates in the same way as the Reflow Soldering screen.

The defect photograph can be enlarged to full screen by clicking on the photograph when the magnifying glass icon is visible over the Photograph window.

On selected defects a video clip may be available when the video tab is highlighted and will run on clicking the Video tab.

5. On completing each section press Main Menu button to return to the titles screen to select another process stage or Exit to exit the program.

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