Summary
This CD ROM is fully interactive and covers the use of through hole
components, design and process requirement when implementing Pin in Hole/Intrusive
assembly. Examples of satisfactory solder standards are provided with a complete guide to
possible process defects with intrusive reflow. The defect section may be viewed with
small examples to make searching easy and then each sample may be viewed at both half and
full screen. A description of each of the defects is included with the examples.
A full animation of the surface mount assembly process is included
on the disk which includes the BGA, double sided assembly and through hole/Intrusive
reflow assembly. This section features a commentary by Bob Willis or can be viewed with
just a text guide.
This CD-ROM complements the video tape, report and photo album
already available in industry and are the first products available in the world to cover
the use of this technology.
Demo
This CD-ROM may be run without a full multi media PC as the
process guide, assembly stages and defect descriptions may be viewed and read without a
sound system. However, maximum benefit will be obtained when using a PC with a sound card.
1. To run from the CD place it in the ROM drive and double click on
File Manager under Program Manager in Windows 3.1 or Explorer in Windows 95 and select
relevant drive. Double click on PIHHOLE, then CDROM and INSTALL.EXE. The program will
start to load and you will be requested to enter the drive name where you wish the program
to be installed. This will take a few moments depending on the speed of the PC. On
completion of installation the program will automatically run.
2. The following main menu will then appear. This allows access to
each of the sections by simply clicking on the relevant text. On each section menu there
is the opportunity to exit and close the program.

3. The first section illustrates the complete modern assembly
process and explains each of the methods used to assemble a printed board. This example
screen shows the solder paste stencil printing operation.

4. Pin in Hole Reflow Assembly is new to many people so the
guidelines can be studied for each of the process stages including component requirements,
PCB design, placement, soldering and inspection.

5. To illustrate each of the process stages video clips are provided
on paste application, manual and automatic insertion, soldering and some of the process
problems are also available to view on each topic.

6. The PIHR Defect Guide and Picture Gallery is contained on a
number of pages each with six defects per page. Often the type of defect is not known, so
a photographic example may be selected for the type of defect, a description and a
magnified view.

7. To re-run the program in the future, select the PIHR icon which
will have been set up when installing the program.
8. To de-install software from PC simply double click the UNINSTALL
icon under the Program Manager screen. |