Year of Publication: 1998
Summary
The CD ROM provides a guide to common defects found at each stage of
printed board manufacturing process. At the first screen you select the process you want
to view which gives you an introduction to the manufacturing process.
The interactive disk includes solutions to the following problems:
Plated through holes, conductors, solder mask, PCB legend, artwork,
surface mount pads, test points and via holes. The process defects include thin PTH
plating, plating cracks, plating voids, poor adhesion and copper nobules. Solderability
defects are provided on through holes, surface mount pads, conductors and via holes.
Solder balling defects are shown on solder resist, peelable masks and conductors.
Measeling and delamination defects are provided for surface defects and with microsection.
The disk provides over 100 common defects on plated through hole, multilayer and flexible
circuits.
Demo
Note: In addition to the Help menu, a text file is also
included on the CD-ROM which contains further information on problem solving and system
setup for the video clips.
1. The program can either be run from the CD or an icon and help
menu may be loaded to the hard disk:
1.1 To run from the CD place the CD-ROM in ROM drive and double
click on File Manager under Program Manager on the Windows 3.1 or Explorer in 95 main menu
and select relevant drive for the ROM on the PC. Double click on pcb_def.EXE and the
program will start to load. This will take a few moments depending on the speed of the PC.
1.2 To load an icon for the program and help menu to the hard disk,
double click on File Manager under Program Manager on the Windows main menu and select
relevant drive for the ROM on the PC. Double click on SETUP.EXE to start installation and
follow onscreen instructions.
2. The following main menu will then appear:
3. From this main menu select any one of the PCB types by clicking
on the relevant button or title. After making your choice an information screen will
appear giving details on the basic manufacturing process and material requirements of the
selected board type. This text box can be scrolled up and down or the individual process
stages can be selected from the list.
Selecting the process menu from the bottom right corner allows
access to more detailed information on the individual fabrication processes used to
produce the printed board type.
As an example, by clicking on the solder resist button this screen
will be revealed giving a description of the different solder resist types and the
processing procedures. Again the list of topics in each section allows a link or the text
can be scrolled. By clicking on the defect section tab the next screen will appear.
4. Under the Defects window select each of the defect titles in turn
and photographs of various process problems will be revealed. Under each of the
photographs is a scrolling text window giving full detailed information of the possible
causes of the illustrated defect.
This defect screen is for solder coatings and operates in the same
way as the solder resist screen.
The defect photographs can be enlarged to full screen by clicking on
the photograph when the magnifying glass icon is visible over the Photograph window. Click
to return to the previous screen.
On selected defects a video clip may be available when the video tab
is highlighted and will run on clicking the Video tab.
5. On completing each section press Main Menu button to return to
the titles screen to select another process stage or Exit to exit the program.
Summary | Demo | Back to CD-ROMs |