Summary
Printed board design and layout is
the key to Zero Defect Manufacture and this CD ROM provides a basic introduction to
Conventional, Surface Mount, Ball Grid Array and Pin In Hole/Intrusive Reflow Assembly.
The interactive CD ROM contains the following guidelines:
- Conventional and surface mount layout
- Surface mount and Conventional footprints
- Resist, via hole, tracking and panel layout
- Solder paste stencil rules
- Printed Board Specifications
A brief introduction to printed board manufacture is provided
along with guidelines on the correct specification of printed boards for fine pitch
surface mount applications. This is ideal for engineers who need a basic introduction to
circuit fabrication.
The defect guide browser provides photographic examples of
defects or poor design rather than defect categories which makes it easy to compare
potential problems with the disk content. Clicking on the photograph provides a full
screen view with an explanation of the possible causes.
Cwo full animations of the surface mount and conventional
assembly processes are included on the disk which includes the BGA, double sided assembly
and through hole/Intrusive reflow conventional assembly and wave soldering. This section
features a commentary by Bob Willis one of the UK's leading process engineers or it can be
viewed with just a text guide.
Demo
This CD-ROM may
be run without a full multimedia PC as the process guide, assembly stages and defect
descriptions may be viewed and read without a sound system. However, maximum benefit will
be obtained when using a PC with a sound card.
1. To run from the CD place it in the ROM drive and
double click on File Manager under Program Manager in Windows 3.1 or Explorer in Windows
95 and select relevant drive. Double click on PCBDES, then CDROM and INSTALL.EXE. The
program will start to load and you will be requested to enter the drive name where you
wish the program to be installed. This will take a few moments depending on the speed of
the PC. On completion of installation the program will automatically run.
2. The following main menu will then appear with an
introduction to the CD-ROM. This allows access to each of the sections by simply clicking
on the relevant text. On each section menu there is the opportunity to exit and close the
program.
3. The two sections illustrate the conventional and
surface mount assembly process and explains each of the methods used to assemble a board.
This example screen shows the solder paste stencil printing operation.
4. The example screen illustrates printed board
manufacture process. This section covers PTH and multilayer manufacture with selected
video clips.
5. The surface mount footprint design rules provide
dimensions and layout guidelines for most common components including BGA.
6. Each section of the design guide illustrates the
steps of design and layout for cost effective manufacture and assembly.
7. The Design Defect Guide and Picture Gallery is
contained on a number of pages, each with six defects per page. A photographic example may
be selected for the type of defect, a description and a magnified view.
8. To re-run the program in the future, select the
icon which will have been set up when installing the program.
9. To de-install software from PC
simply double click the UNINSTALL icon under the Program Manager screen.
Summary | Demo |
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