Interactive CD-ROM

We currently offer one of the largest collections of interactive CD-ROM in the industry dedicated to printed board design, assembly and quality control which are ideal to support your on site training requirements. If you need to produce your own training courses, inspection documents or illustrate technical reports we also offer many photo albums packed with images to make the creation of presentation material less time consuming for engineers and administrators. To order any products please, click here

Conformal Coating Applications, Inspection, Rework & Quality Control Guide

The use of Conformal coating has provided benefits to industry for many years either in the high reliability market sector or where products have to deal with extreme environmental conditions. In recent years due to changes in technology and miniaturisation coating are being used in consumer applications. The use of coatings is seen in different industries like telecommunications, automotive and consumer products have benefited from the use of selective coating but for different reasons. The CD-ROM provides a simple guide to the use of coatings, their application and process, product benefits, inspection and quality control. A practical defect guide session will also allow delegates to examine coated boards using different materials and inspect the coating application. A unique feature of the CD is a number of engineers answering question on coating processes, process defects and quality control in manufacture.

CD-ROM Topics Included:
Why Conformal Coat
Clean or No Clean
Coating Material Options
Coating Process Options
Cost of coating assemblies
SIR and cleanliness testing
Cleanliness testing methods
Reliability of Coating

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Package on Package (PoP) Assembly, Inspection & Rework Guide

Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and, with it, placing further demands on assembly engineers. In simple terms PoP represents the stacking of components one on top of another either during the original component manufacture or during printed board assembly. As real estate is at a premium for logic and memory, PCB designers say the only way to go is up and up. PoP packaging systems may include direct soldering, wire bonding or conductive adhesives for device to device interconnection. PoP is new to many contract and OEM assembly staff but with the demands of paste dipping, reflow warpage, increased placement accuracy and Z height control, process introduction can be demanding. The difficulty in multi level ball inspection can be a challenge for x-ray equipment procedures as level one balls can mask level two and three interconnections. Manual inspection can be used but with these applications space is often not available for side viewing.

CD-ROM Topics Included:
What is Package on Package (PoP)?
Benefits of PoP Stack Packages
Component Standards
Component Types
JEDEC Standards
PCB Design Rules
Pad Layout
Via Hole Connection
Lead-Free Assembly
Engineering Interviews

BGA Inspection & Lead-Free Defect Guide

Interactive CD-ROM covering optical and x-ray inspection of solder joints produced jointly by Bob Willis. It includes an introduction to the lead-free assembly process with specific attention to BGA and area array devices. It provided a step by step guide to the procedure of inspection for optical and x-ray showing you how to do it. Inspection criteria are included for x-ray and visual criteria on different lead-free terminations and pad surfaces. The CD also includes many defect examples and causes as well as illustrating the reflow of different terminations with Bob Willis’s unique micro video clips.

LGA/QFN Design, Assembly, Rework & Defect Guide

If you are using PowerPoint for training or technical sales presentations and need to illustrate the conventional, surface mount & LGA/QFN assembly process stages this CD-ROM is for you. The LGA/QFN Assembly is a standard PowerPoint presentation including video clips and many photographs illustrating the design, assembly, inspection and rework process for LGA/QFN packages and has been presented worldwide during our workshops. In the second two presentations each stage of the SMT and Conventional assembly process is illustrated with video animations and commentary, each slide describes the basic process stages. The PowerPoint format makes it ideal to edit each presentation, leave out slides or add additional photographs, text depending on your requirement and for busy engineers 90% of the work has been done for you. We have also included 11 "Lead-free Casebooks" featured in Circuits Assembly

Printed Circuit Board Design & Lead-Free Defect Guide 2 CD-ROM

Printed board design and layout is the key to Zero Defect Manufacture and particularly true for lead-free. Design and development engineers must convert their build of materials to make all components lead-free and process compatible. This CD-ROM provides a basic introduction to Conventional, Surface Mount, Ball Grid Array and Pin In Hole/Intrusive Reflow Assembly including changes for lead-free with the following:

Conventional and surface mount layout
Surface mount and Conventional footprints
Resist, via hole, tracking and panel layout
Solder paste stencil rules
PCB layout & Design defects
Lead-free process defects

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Wave Soldering Introduction & Defect Guide 2

Second edition of the CD provides a guide to all aspects of wave soldering with all the common process defects. Each stage of the process including fluxing, pre heat, solder wave and conveyors are explained along with materials used and the changes necessary for lead-free. At the first screen you can select the soldering process, equipment set-up, quality control, defect guide and CD ROM operation. The defect guide browser provides examples of defects rather than defect categories which makes it easy to compare process problems with the disk content. Clicking on the photograph provides a full screen view with an explanation of the possible causes. .Also included on the CD ROM are procedures for Parts Per Million Monitoring, process control procedures and set-up methods. A spread sheet is provided which may be used for defect monitoring using the PPM procedures.

Soldertec Lead-Free Wave Soldering Interactive CD-ROM

Third in a series of interactive CD-ROMs developed by Soldertec Global to assist engineers with the practical introduction of lead-free wave soldering materials and processes. Introduced by Kay Nimmo, Technical Director, Tin Technology, the CD provides a step-by-step guide to wave soldering, wetting, fluxing, process control, inspection. Process animations explain the wave soldering process options and video is used to further enhance the process stages. Inspection criteria for wave solder joints are illustrated for different alloys. Common wave soldering defects are included which may be seen in manufacture, reasons and possible corrective action is provided. The CD also features an interactive quiz on wave, reflow and hand soldering to help assess staff’s knowledge on the use of lead-free materials.

Soldertect Lead-Free Reflow Soldering Interactive CD-ROM

Interactive CD-ROMs developed by Soldertec Global to assist engineers with the practical introduction of lead-free materials and processes. Introduced by Kay Nimmo, Technical Director, Tin Technology, the CD provides a step-by-step guide to solder paste materials, convection and vapour phase soldering steps, lead-free inspection and common reflow defects which may be seen in manufacture. The process stages and defects are illustrated with video clips. The CD also features an interactive quiz on hand, reflow and wave soldering to help assess staff’s knowledge on the use of lead-free materials. Additional CD-ROMs will be released shortly covering other aspects of lead-free alloys and the changes necessary in manufacture to meet the deadline of July 2006.

Soldertec Hand Soldering & De-Soldering Lead-Free Interactive CD-ROM

This is the first in a series of interactive CD-ROMs developed by Soldertec Global to assist engineers with the practical introduction of lead-free materials and processes. Introduced by Kay Nimmo, Technical Director, Tin Technology, the CD provides a step-by-step guide to materials, soldering steps, inspection and common defects which may be seen in manufacture. The CD also features an interactive quiz on hand, reflow and wave soldering to help assess staff’s knowledge on the use of lead-free materials. Two additional CD-ROMs will be released shortly covering the use of wave and reflow soldering with lead-free alloys and the changes necessary in manufacture to meet the deadline of July 2006.

Conventional and Surface Mount Process Introduction

If you are using PowerPoint for training or sales presentations and need to illustrate the conventional and surface mount assembly process stages SMART Group have a new C-ROM for you. The CD features two presentations one on conventional through hole assembly, the second features surface mount and mixed technology assembly process stages. Each stage of the process is illustrated with animations and commentary, each slide describes the basic process stages. The PowerPoint format makes it ideal to edit each presentation, leave out or add additional photographs, text depending on your requirement.

SMT/Conventional Inspection and Quality Control CD-ROM

The latest CD from SMART Group provides inspection criteria for surface mount and conventional assembly and soldering as well as providing a defect guide for common defects found during wave and reflow soldering. Included on the CD is a complete guide to introducing yield monitoring based on Part Per Million PPM or Defects Per Million DPM with a spreadsheet for recording the defects. Video sequences show how to fill in the forms using screen printing as a reference. Animated process guides highlight other process stages for both conventional and SMT where in-process sample inspection should be conducted.

Also included are a range of in process quality control procedures for each stage of the process, which is considered critical as well as visual guidelines for acceptable criteria. These cover screen printing, stencil checks, placement, component loading, reflow, wave soldering, manual assembly and final inspection. These procedures are ideal for any company standard or as a guide to the minimum standards for contracting out assembly. An interactive test is provided to assess your staff's understanding of inspection criteria and normal in process control. Twenty questions are included and the results are saved for each staff member taking the test.

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Rework and Repair of Conventional & SMT 2

The first screen introduces the user to the CD-ROM and the key topics covered in each section including conventional surface mount desoldering operations. Each section of the CD can be selected by using the interactive buttons next to the subject. The main screen also features an exit button to end the program. The CD features a complete introduction to surface mount and through hole assembly which may be followed with the on screen text or use of the audio tracks. This section shows the screen printing process for solder paste application. The component removal section covers surface mount chip, SOIC, PLCC, BGA and conventional through hole component removal. Each section provides video clips illustrating the component removal and text sections which gives the step by step procedures. The component replacement section again covers chip, SOIC, PLCC, BGA and through hole parts and additional topics like screen printing, solder short removal and BGA reballing of reworked parts.

The European inspection standards cover all the surface mount placement and soldering standards and can be accessed from this page. More detailed text based standards are also available for reference. The defect gallery provides photographs of defects seen during rework. Each photograph may be clicked to reveal a larger view of the defect. In the larger view of the defect section a text screen provides a description of the defect, possible causes and corrective actions for the process. There are a wide range of suppliers of surface mount and conventional through hole equipment and a selection of suppliers' details is provided on the CD-ROM for reference.

Reflow Soldering And Temperature Profiling 2

This CD ROM is fully interactive and covers the use of single sided and double sided reflow assembly. It includes animations and video clips showing the set-up of a reflow process and how to conduct a temperature profile. Two sections show how to attached thermocouples with a full written instructions. Interactive sections explain the temperature profile and what each stage must achieve and why. The video clips feature process equipment from Electrovert, Seho, ECD and others. Examples of satisfactory solder standards are provided with a complete guide to possible process defects. The defect section may be viewed with small photographic examples to make searching easy and then each sample may be viewed at full screen. A description of each of the defect photographs is included with the possible causes. The CD also contains video clips of soldering BGA, Pin In Hole Reflow, Solder Beading and lots lots more. A full animation of the surface mount assembly process is included on each of the CD-ROM which includes the BGA, double sided assembly and through hole/Intrusive reflow assembly. The CD is ideal for shop floor reference or training new engineers in the use of reflow soldering processes. Also included on the ROM is the latest issues of profiling software and user manuals.

Pin In Hole Intrusive Assembly And Defect Guide 2

This CD ROM is fully interactive and covers the use of through hole components, design and process requirement when implementing Pin in Hole/Intrusive assembly. Examples of satisfactory solder standards are provided with a complete guide to possible process defects with intrusive reflow. The defect section may be viewed with small examples to make searching easy and then each sample may be viewed at both half and full screen. A description of each of the defects is included with the examples. A full animation of the surface mount assembly process is included on the disk which includes the BGA, double sided assembly and through hole/Intrusive reflow assembly. This section features a commentary by Bob Willis or can be viewed with just a text guide. This CD-ROM complements the video tape, report and photo album already available in industry and are the first products available in the world to cover the use of this technology.

Guide to Simultaneous Double Sided Reflow Soldering CD-ROM

In any process there are always opportunities to improve the process, reduce the number of process stages or reduce the cost of manufacture. Engineering is always looking at alternative processes, Simultaneous Double Sided Reflow (SDSR) is a possible new candidate to provide cost savings and increased throughput. The process will be featured at Nepcon Electronic exhibition next week and is the latest Interactive CD-ROM available from the SMART Group. The process was first described in the SMART Group Charity Report SDSRS which has raised money for worthy projects in the UK and America.

In simple terms the process involves screen printing and placing components on both sides of the board with the option of using through hole components. Finally the whole assembly is run through a single reflow soldering process to solder both sides of the board and potentially the through components as well. It is currently being considered by two Japanese companies and reported being used by Philips in Europe and a couple of UK companies.

The interactive CD-ROM covers:
SDSRS Advantages
SDSRS Disadvantages
Screen Printing
Adhesive Dispense
Adhesive Requirements
Component Placement
Reflow Soldering
Final Inspection
Process Issues
Process Results

Interactive Ball Grid Array Assembly Inspection And Defect Guide

This CD ROM is fully interactive and covers the different types of BGA component, design and process requirement with X-ray inspection of solder joints and a inspection standard for guidance. A Word document of the text is available on the CD ROM for use in a company standard and may be edited to suit the company documentation system. Examples of satisfactory standards are provided with a complete guide to possible process defects. The defect section may be viewed with small examples to make searching easy and then each sample may be viewed at both half and full screen. A description of each of the defects is included with the examples.

A full animation of the surface mount assembly process is included on the disk which includes the BGA, double sided assembly and through hole/Intrusive reflow assembly. This section features a commentary by Bob Willis or can be viewed with just a text guide. The CD ROM also includes over 130 picture files which may be used freely in training material and standards in a manufacturing company provided that the resulting material is not resold.

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Bob Willis Surface Mount Process Defect Guide 2

The CD ROM provides a guide to common process defects found at each stage of the SMT process. It also includes defects specifically on printed boards and components. At the first screen you select the process you want to view which gives you an introduction to the processes listed below.
Printed Boards, Components inc; BGA, Screen Print, Adhesive Application, Placement, Reflow Solder, Wave Solder, Cleaning, Rework
In the case of printed board section it explains the most important issues with surface mount circuits. It then lists common process defects which can be selected to reveal a photographic example of the defect type and an explanation of the possible causes.

Surface Mount Interactive Knowledge Assessment CD ROM

The disk provides sets of interactive question and answer tests for engineering, production and quality staff. It is designed to be used after any formal training courses to test a group or a single member of staff and their understanding of different surface mount topics. It may also be used to assist the selection of new staff members during company interviews where colour and component recognition is particularly important. The CD ROM contains a series of questions on each of the following subjects:

Colour Coding, Printed Circuit Boards, Component Recognition, Solder Paste Printing, Component Placement, Reflow Soldering, Wave Soldering, Cleaning, Rework and Repair, Solder Joint inspection. Each question has multiple choice answers which must be selected prior to moving onto the next question. Both correct and incorrect answers are acknowledged and the answers recorded to disk along with the student name. The test can be repeated with the number of attempts again recorded to disk for future reference. Selected subjects like joint inspection and component recognition have photographic examples for the student to assess. After working through the multi choice question and answer session a report of the correctly answered questions is produced for the instructor on each student. A copy of the questions and answers are also included as a .txt and .doc files on the hard disk for manual testing and for possible modification of the test questions.

Lead-Free Assembly & Soldering Cook Book 3

If you want a quick introduction to lead-free, why not get a copy of the "Lead-Free Assembly and Soldering Cook Book3" the worlds first interactive CD-ROM. It was produced jointly by National Physical Laboratory and Electronic Presentation Services and is now on its third edition. There are now two CDs which include video interviews, lead-free material guide, interactive defect browser, process animations and lots more. Its ideal for process and design engineers, quality staff and material and equipment suppliers.

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