| Title |
Author |
Publisher |
Bob Willis'
Top Ten Reference Books 2004 |
| Area
Array Interconnection Handbook |
Karl
Puttlitz and Paul A Totta |
Kluwer
Publishing |
| Comprehensive
Guide to Design, Manufacture of Printed Board Assemblies |
Bill
MacLeod Ross |
Electrochemical
Publications |
| Flexible
Circuit Technology |
Joseph
Fjelstad |
SVPG |
| Quality
Assessment of Printed Circuit Boards (Out of Print) |
Preben
Lund |
Bishop
Graphics Inc. |
| Reflow
Soldering Processes and Troubleshooting SMT, BGA, CSP and Flip
Chip Technologies |
Ning-Cheng
Lee |
Newnes |
| SMT
for PC Board Design (2nd Edition) |
James
Hollomon |
Prompt
Publications |
| Printed
Circuit Board Manufacture 5th Edition |
Clyde
F. Coombs Jr |
McGraw
Hil |
| Electronic
Failure Analysis Handbook |
Edited
by Perry Martin |
McGraw
Hill |
| Microelectronics
Packaging Handbook (1st Edition) |
Tummala
and Rymaszewski |
Van
Nostrand Reinhold |
| Soldering
in Electronics (2nd Edition) |
Klein
Wassink |
Electrochemical
Publication |
| |
|
|
More
Reviews |
| IC
Component Sockets |
Weifeng
Liu and Michael Pecht |
Wiley Interscience |
| Implementing
Lead-Free Electronics |
Jennie
S Hwang |
McGraw-Hill
Professional Engineering |
| Lead-Fee
Soldering in Electronics - Science, Technology and Environmental
Impact |
Katsuaki
Suganuma |
|
| Area
Array Interconnection Handbook |
Karl
Puttlitz and Paul A Totta |
Kluwer
Publishing |
| Integrated
Passive Component Technology |
Richard
Ulrich and Leonard Schaper |
|
| Fundamentals
of SMD Assembly |
Sjef
van Gastel, Marina Nikeschina, Rita Petit |
RTFB
Publishing |
| Lead-Free
Electronics - 2004 Edition |
Sanka
Ganesan & Michael Pecht |
CACE
EPSC Press |
| Accelerated
Reliability Engineering HALT and HASS |
Gregg
K Hobbs |
John
Wiley & Sons |
| Microstereolithography
and Other Fabrication Techniques for 3D MEMS |
Vijay
K Varadan, Xiaoning Hang, Vasundara V Varadan |
John
Wiley & Sons |
| Quick
Pocket Reference for Solder Assembly |
|
AIM
Solders |
| Structural
Integrity and Reliability in Electronics - Enhancing Performance
in a Lead-Free Environment |
W.J
Plumbridge, R.J. Matela & Angus Westwat |
Kluwer
Academic Publishers |
| Printed
Circuit Board Basics - An Introduction to the PCB Industry
|
Dan
Beau |
UP
Media Group |
| Coating
Materials for Electronic Applications |
James
J. Licari |
Noyes
Publications |
| Guide
To Lead-Free Soldering for Assemblers & Sub-Contractors |
Roger
Bilham |
|
| Interactive
Guide to Flexible Circuit Technology |
|
Teknoflex
www.teknoflex.com |
| Chip
Scale Packaging for Modern Electronics |
Joseph
Fjelstad, Reza Ghaffarian, Young-Gon Kim |
Electrochemical
Publications |
| Area
Array Packaging Handbook |
Ken
Gilleo |
Newnes |
| Understanding
Automotive Electronics |
William
Ribbens |
Publisher
McGraw Hill |
| Bebop
to the Boolean Boogie |
Clive
Maxfield |
Newnes |
| Lead-Free
Handbook |
Katsuaki
Suganuma, Osaka University |
Horizon Inc, K Books Series |
| Physical
Metallurgy Handbook |
Anil
Kumaer Sinha |
McGraw
Hill |
| Fabricating
Printed Circuits Boards |
Jon
Varteresian |
Newnes |
| Electronics
Manufacturing with Lead-Free, Halogen Free & Conductive Adhesive |
John
Lau, Ricky Lee, Ning Chang Lee and Wong |
McGraw-Hill |
|
The BSAC Diving Manual |
|
BSAC |
| Six
Sigma for Electronics Design & Manufacturing |
Sammy
G Shina Ph.D. |
Electrochemical
Publications |
| Dry
Film Photoresist Processing Technology |
Karl
Dietz |
McGraw Hill |
| Printed
Circuit Board Manufacture 5th Edition |
Clyde
F. Coombs Jr |
McGraw
Hil |
| Reflow
Soldering Processes and Troubleshooting SMT, BGA, CSP and Flip
Chip Technologies |
Ning-Cheng
Lee |
Newnes |
| Environmental-Friendly
Electronics: Lead-Free Technology |
Jennie
S. Hwang |
Electrochemical
Publications |
| Fundamentals
of Microsystems Packaging |
Rao
R Tummala |
McGraw Hill |
| Microchip
Fabrication - A Practical Guide to Semiconductor Processing |
Peter
Van Zant |
McGraw
Hill |
| Microvias
for Low Cost High Density interconnects |
John
H Lau and Ricky Lee |
McGraw Hill |
Standard
Handbook of Environmental Engineering |
Robert
Corbitt |
McGraw
Hill |
| Solders
and Soldering - Fourth Edition |
Howard
Ma |
McGraw Hill |
| High
Performance Printed Circuit Boards |
Charles
Harper |
McGraw
Hill |
| Handbook
of Mechanical Engineering Calculations |
Tyler
G Hicks |
McGraw Hill |
| Electronic
Packaging and Interconnection Handbook 3rd Edition |
Charles
A Harper |
McGraw
Hill |
| Low
Cost Flip Chip |
John
Lau |
McGraw Hill |
| Green
Electronics/Green Bottom Line |
Lee
H Goldberg |
Newnes
Publications |
| Electronic
Connector Handbook |
Robert
S Mroczkowski |
Electrochemical
Publications |
| Surface
Mount Technology Terms & Concepts |
Phil
Zarrow and Debra Kopp |
Newnes
Butterworth-Heinemann |
| Surface
Mount Handbook |
Keith
Gurnett |
Reed
Electronics Research |
| Surface
Mount Technology for PC Boards |
James
K Hollomon Jr |
Butterworth-Heinemann |
| Engineers
Handbook of Encapsulation and Underfill Technology |
Martin
Bartholomew |
Electrochemical
Publications |
| Conductive
Adhesives for Electronics Packaging |
Johan
Liu |
Electrochemical
Publications |
| Design
of Stencils for Printing Solder Paste on Surface Mount Printed
Boards |
David
Boswell |
Electrochemical
Publications |
| Aqueous
Cleaning Handbook |
Malcolm
McLaughlin and Alan Zisman |
|
| Printed
Circuit Board Materials Handbook |
Edited
by Martin Jawitz |
|
| Electronic
Failure Analysis Handbook |
Edited
by Perry Martin |
McGraw
Hill |
| Chip
Scale Package |
John
Lau and Ricky Lee |
McGraw
Hill |
| Microelectronics
Packaging Handbook Second Edition CD-ROM |
Edited
by Rao Tummala, Eugee Rymaszewski, Alan Klopfenstein |
Chapman
and Hall |
| Focus
on In-Circuit Testing - Second Edition |
GenRad
Corporation |
|
| Modern
Soldering Technology |
Jennie
Hwang |
McGraw
Hill |
| Printed
Circuit Handbook |
Clyde
Coombs, Jr |
McGraw
Hill |
| Ball
Grid Array Technology |
John
Lau |
McGraw
Hill |
| Flexible
Circuit Technology |
Joseph
Fjelstad |
SVPG |
| Soldering
in Electronic Assembly |
Mike
Judd & Keith Brindley |
Butterworth
Heinemann |
| Design
Guidelines For Surface Mount |
Vern
Solberg |
McGraw
Hill |
| Wire
Bonding in Microelectronics - Second Edition |
George
Harman |
McGraw
Hill |
| Handbook
of Lead-Free Soldering Technology for Microelectronic Assemblies
|
Karl
Puttliz and Kathleen Stalter |
Marcel
Dekker |
