Bob Willis - The Industry Specialist for Surface Mount Technology (SMT) Reflow Soldering Process Defects

This section has been developed to help you identify many of the common problems that may arise within the PCB production process. The guides explain how and why these occur and what steps may be taken to rectify them.

Capacitor Cracking	Capacitor Cracking	Component Cracking	Crystallised Joints	Cracked Joint
Cracked Joint	Chip Leaching	Component Lift	Component Lifting	Component Lifting
Joint Failure	Joint Voiding	Non Reflow	Non Reflow	Non Reflow
Non Wetting	Open Joint	Open Joint	Plastic Cracking	Plastic Coplanarity
PCB Measelling	Poor Pad Wetting	Poor Solderability	Poor Solderability	Plastic Softening
Poor Solderability	Poor Solderability	QFP Cracking	Solder Beading	Solder Beading
Solder Beading	Solder Beading	Solder Short	Solder Short	Solder Short
Solder Wicking	Solder Wicking	Solder Wicking	Solder Wicking

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