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Pin In Hole Intrusive Reflow Assembly Standards

5 A3 posters includes X-Ray inspection guide of satisfactory BGA solder joints and process defects, x-ray images are black and white.
   
Bob Willis, Process Engineering Consultant Electronic Presentation Services
2 Fourth Avenue Chelmsford Essex CM1 4HA England Tel: (44) 01245 351502 Fax: (44) 01245 496123
Email: bob@bobwillis.co.uk