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SUMMARY |
This CD ROM is fully interactive and covers the use of
through hole components, design and process requirement
when implementing Pin in Hole/Intrusive assembly. Examples
of satisfactory solder standards are provided with a complete
guide to possible process defects with intrusive reflow.
The defect section may be viewed with small examples to
make searching easy and then each sample may be viewed at
both half and full screen. A description of each of the
defects is included with the examples.
A full animation of the surface mount assembly process
is included on the disk which includes the BGA, double sided
assembly and through hole/Intrusive reflow assembly. This
section features a commentary by Bob Willis or can be viewed
with just a text guide.
This CD-ROM complements the video tape, report and photo
album already available in industry and are the first products
available in the world to cover the use of this technology.
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DESCRIPTION |
This
CD-ROM may be run without a full multi media PC as the process
guide, inspection standards and defect descriptions may be
viewed and read without a sound system. However, maximum benefit
will be obtained when using a PC with a sound card. |
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1
To run from the CD place it in the ROM
drive and double click on File Manager under Program Manager
in Windows 3.1 or Explorer in Windows 95 and select relevant
drive. Double click on PIHHOLE, then CDROM and INSTALL.EXE.
The program will start to load and you will be requested to
enter the drive name where you wish the program to be installed.
This will take a few moments depending on the speed of the
PC. On completion of installation the program will automatically
run. |
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2
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The following main menu
will then appear. This allows access to each of the sections
by simply clicking on the relevant text. On each section menu
there is the opportunity to exit and close the program. |
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3
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The
first section illustrates the complete modern assembly process
and explains each of the methods used to assemble a printed
board. This example screen shows the solder paste stencil
printing operation. |
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4
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Pin
in Hole Reflow Assembly is new to many people so the guidelines
can be studied for each of the process stages including component
requirements, PCB design, placement, soldering and inspection. |
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5
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To
illustrate each of the process stages video clips are provided
on paste application, manual and automatic insertion, soldering
and some of the process problems are also available to view
on each topic. |
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6
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The
PIHR Defect Guide and Picture Gallery is contained on a number
of pages each with six defects per page. Often the type of
defect is not known, so a photographic example may be selected
for the type of defect, a description and a magnified view. |
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| 7
To re-run
the program in the future, select the PIHR icon which will
have been set up when installing the program. |
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8
To de-install
software from PC simply double click the UNINSTALL icon
under the Program Manager screen.
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