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SUMMARY |
This
CD ROM is fully interactive and covers the different types
of BGA component, design and process requirement with X-ray
inspection of solder joints and a inspection standard for
guidance. A Word document of the text is available on the
CD ROM for use in a company standard and may be edited to
suit the company documentation system. Examples of satisfactory
standards are provided with a complete guide to possible process
defects. The defect section may be viewed with small examples
to make searching easy and then each sample may be viewed
at both half and full screen. A description of each of the
defects is included with the examples. A full animation of
the surface mount assembly process is included on the disk
which includes the BGA, double sided assembly and through
hole/Intrusive reflow assembly. This section features a commentary
by Bob Willis or can be viewed with just a text guide. The
CD ROM also includes over 130 picture files which may be used
freely in training material and standards in a manufacturing
company provided that the resulting material is not resold. |
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DESCRIPTION |
This
CD-ROM may be run without a full multi media PC as the process
guide, inspection standards and defect descriptions may be
viewed and read without a sound system. However, maximum benefit
will be obtained when using a PC with a sound card. |
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1
To run from the CD place it in the ROM
drive and double click on File Manager under Program Manager
in Windows 3.1 or Explorer in Windows 95 and select relevant
drive. Double click on BGAROM, then CDROM and INSTALL.EXE.
The program will start to load and you will be requested to
enter the drive name where you wish the program to be installed.
This will take a few moments depending on the speed of the
PC. On completion of installation the program will automatically
run. |
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2
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The following main menu
will then appear. This allows access to each of the sections
by simply clicking on the relevant text. On each section menu
there is the opportunity to exit and close the program. |
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3
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The
first section illustrates the complete modern assembly process
and explains each of the methods used to assemble a printed
board. This example screen shows the fluxing stage used during
wave soldering. |
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4
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Ball
Grid Array devices are new to many people so each of the device
types is illustrated in the BGA Component section. Clicking
on the questionmarks reveals the brief description of each
of the components. |
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5
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At
present there are no national or international inspection
standards for BGA or X-ray inspection. A basic document is
included under the X-ray Inspection section and this may be
searched for relevant joint criteria. |
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6
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This
section is also illustrated with examples of each of the most
common surface mount terminations. The examples may be enlarged
full screen and viewed with the relevant criteria. |
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7
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The
BGA Defect Guide and Picture Gallery is contained on a number
of pages each with six defects per page. Often the type of
defect is not known, so a photographic example may be selected
for the type of defect, a description and a magnified view. |
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8
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This
example is one of the defect views shown at half screen
with the scrollable text box which accompanies each of the
defects in the photographic gallery.
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9
To re-run the program in the future, select the BGA icon which
will have been set up when installing the program. |
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