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1
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The
first screen introduces the user to the CD-ROM and the key
topics covered in each section including conventional and
surface mount desoldering operations. |
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2
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Each
section of the CD can be selected by clicking on the interactive
buttons next to the subject. The main screen also features
an exit button to end the program. |
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3
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The
CD features a complete introduction to surface mount and
through hole assembly which may be followed with on screen
text or by use of the audio tracks. This screen shot shows
the screen printing process for solder paste application.
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4
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The
component removal section covers surface mount chip, SOIC,
PLCC, BGA and conventional through hole component removal.
Each section provides a video section illustrating the component
removal and text sections which gives a step by step procedure
for component removal. |
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5
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The
component replacement section again covers chip, SOIC, PLCC,
BGA and through hole parts and additional sections like
screen printing for BGA, solder short removal using braid
and BGA reballing of reworked parts. |
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6
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The
European inspection standards section cover all the surface
mount placement and soldering standards and can be accessed
from this page. A more detailed text based standard is also
available for reference. The text document is also provided
on the CD for companies to use or adapt into an in-house
document. |
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7
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The
criteria for "J" lead terminations is provided
visually and via a text box. Criteria for acceptable and
unacceptable examples can be seen via the arrow keys at
the bottom of the screen.
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8
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The
rework defect gallery provides photographs of defects seen
during rework. Each photograph may be clicked to reveal
a larger view of the defect. |
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In
the larger view of the defect section a text screen provides
a description of the defect, possible causes and corrective
actions. |
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10
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There
are a wide range of suppliers of surface mount and conventional
through hole rework equipment. A selection of suppliers
are provided on the CD-ROM for possible reference. |
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