Bob Willis - The Industry Specialist for Surface Mount Technology (SMT) Process Defects and Problems

NPL interactive "Lead-Free Assembly and Soldering Cook Book 3" CD-ROM is now on two CD-ROMs to include even more international views on lead-free making a total of 20. The latest views on lead free come from the likes of Dieter Bergman-IPC, Jennie Hwang, Phil Zarrow-ITM and Bill Kenyon all from the USA giving their prospective on issues faced by the industry. This was the World's First interactive resource on lead-free soldering technology It remains the first ever produced, now its on version 3 produced jointly by The National Physical Laboratory and Bob Willis in 1999 to address the following aspects of the technology:

Design Rules, PCB Solderable Finishes, Component Terminations, Impact on Process Conditions, Impact on Existing Equipment, Hand Soldering, Screen Printing, Reflow Soldering, Wave Soldering, Cleaning, Rework, Visual Inspection, Joint Reliability, In Circuit Test. Whether a large OEM or a small CEM, a supplier or user, this project brings together all you ever wanted to know about Lead-Free assembly technology.

More details can be found here.

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