Printed board design and layout is the key to Zero Defect
Manufacture and this CD ROM provides a basic introduction
to Conventional, Surface Mount, Ball Grid Array and Pin
In Hole/Intrusive Reflow Assembly.
The interactive CD ROM contains the following guidelines:
Conventional and surface mount layout, Surface mount and
Conventional footprints, Resist, via hole, tracking and
panel layout, Solder paste stencil rules, Printed Board
Specifications
A brief introduction to printed board manufacture is provided
along with guidelines on the correct specification of printed
boards for fine pitch surface mount applications. This is
ideal for engineers who need a basic introduction to circuit
fabrication.
The defect guide browser provides photographic examples
of defects or poor design rather than defect categories
which makes it easy to compare potential problems with the
disk content. Clicking on the photograph provides a full
screen view with an explanation of the possible causes.
Two full animations of the surface mount and conventional
assembly processes are included on the disk which includes
the BGA, double sided assembly and through hole/Intrusive
reflow conventional assembly and wave soldering. This section
features a commentary by Bob Willis one of the UK's leading
process engineers or it can be viewed with just a text guide.
)
)
)
)
)
)
